WIDE BAND RF MUDULES DEVELOPMENT
- INTEGRATED PCB/PACKAGE SOLUTION
- COPPER CORE MIXED MULTILAYER
- HIGH POWER THERMAL MANAGEMENT
- HERMETICITY
MODULE ASSEMBLED
TOP/BOTTOM VIEW
OF COPER CORE MIXED PCB
PARTS TO BE ASSEMBLED
WIDE BAND RF MUDULES DEVELOPMENT
MODULE ASSEMBLED
TOP/BOTTOM VIEW
OF COPER CORE MIXED PCB
PARTS TO BE ASSEMBLED